Hpaga arai hpe sang lang dan ai
13.3 touch screen hte cypress touch controller ic gaw gloves, hka hte bungli galaw ai hpe madi shadaw ya lu ai, 10mm galu ai tempered glass (sh) galu ai PC hte cover glass ntsa kaw kaja hkra bungli galaw lu ai, , madung hku nna tsi mawan ni, ndau shabra ai arung arai ni, htaw sa mai ai mobile terminal ni, shimlam, depth hte kaga madi shadaw ai lam ni lawm ai. ntsa lam hpe gram lajang ai lam --AG AR AF, n tara ai hkrang masa etc.
13.3 touch screen hpe USB interface kaw nna hkrak sha shapraw ai, 1920*1080 resolution madun ai screen hte EDP interface kaw nna hkrak sha shapraw ai rai nna, dai gaw shinggyim masha ni lang ai Operation system amyu myu hte htuk manu ai, dai hpe drive board hte cable ni hte htuk manu ai, dai gaw flat assemble product structure hpe jung na matu grau htuk manu ai. Dai grup yin na silk screen hpe ka shapraw ai gaw nsam hpraw ai, display polarizer gaw nsam hpraw ai, dai majaw nbung n-gun atsam a Black effect gaw grau kaja ai;
| Model nambat | HX1331806 |
| Dazik | Grahowlet |
| Hkrang | 13.3 inch |
| Bungli galaw ai nbung katsi | -20℃- 70 degree |
| Hkring ai shara a katsi kahtet | -30℃- 80 degree |
| Outline shadawn shadang | mm |
| Yu ai shara | 294.76(W)x166.24(H) mm |
| Active ginra | 293.76(W)x165.24(H) mm |
| Madi shadaw ai ladat ni | Windows/Android/Linux ni zawn re ai ni hpe mu lu na re. |
| Garantii | 1 ning |
| Interface amyu | IIC/USB |
| Hkrang | G+G |
| Hkang ai IC | Cyper hpun |
| hkra ai shara ni | Madang 10 |
| Hkrang nsam | 85% hta grau kaba ai (sh) maren sha re |
| Ntsa n-tsa ngang kang ai | 6H hta grau kaba ai (sh) maren sha re. |
| N-gun jaw ai Voltage | 2.8V - 3.3V |
| Dawdan lam | 1920*1080 |
| Interface amyu | EDP/HDMI/VGA |
| Nhtoi htoi ai | 300 cd/m2 |
| Yu ai angle | YAWNG |
Hpaji masa ga san san ai
San: Gara masa hta optical bonding touch screen module hparan ladat hpe myit yu na kun?
A: 1. Customer wa gaw, dai arai a tsawm htap ai lam yawng a matu grau ra sharawng ai rai yang, shanhte gaw optical bonding hpe myit yu mai ai, hpa majaw nga yang, optical bonding galaw ngut ai hpang, module ting a black effect ting gaw grai kaja ai; 2. Customer a arai hkum nan shi a bungli galaw ai shara hta anti-shock effect hte hkra machyi ai lam hpe ninghkap lu ai zawn re ai ra kadawn ai lam ni grai law ai rai yang, optical bonding hparan ladat hpe myit yu mai ai; 3. Customer a arai hpe shinggan de lang ai rai nna, Jan a shingran nsam hte hot & cold shocks ni a ngang grin ai lam hte yawng a hkrang bung sumla ni hta ra kadawn ai lam nkau mi nga yang, optical bonding plan hpe myit yu ra ai;
San: Hkum tsup ai jahtum na arung arai ni hpe EMC chyam dinglik ai hta ESD a matu gara ladat ni nga ai kun?
A: yawng hpe hparan lu na matu gaw, static wan hpe ga de lwi shangun na matu re. Lahta na hpaji jaw ga ni hpe roughly hku nna mu lu ai:
1), n-gun jaw ai lam hte TVs Tube: n-gun jaw ai lam VCC hpe ESD makawp maga na matu, TVs tube hpe matut nna hparan mai ai. TVs ni a tube gaw voltage hpe hkang ai diode hte grai bung ai. Rated voltage nga ai. Shai hkat ai lam gaw, shi a mahtai jaw ai lawan ai lam gaw grau nna lawan ai hte static electricity hpe kaja ai discharge effect nga ai.
2) Shinggan na interface signal line hpe ESD makawp maga ai lam: n-gun jaw ai (sh) lamu ga de n-gun hpe lam madun na matu reverse diode hpe myit yu nna matut mai ai;
3), LC filtering hpe hkam sha chye ai jak ni a power supply hta jat bang ai: IC nkau mi gaw static wan n-gun hpe grau nna hkam sha chye ai. ESD chyam dinglik ai lam galaw ai shaloi, reset (sh) si ai lam galoi mung byin chye ai. Hpa majaw nga yang, power supply pin hpe n-gun n jaw ai majaw re. Ndai lam a matu, shi a power supply hta LC filtering hpe bang mai ai.
4) PCB paving galaw ra ai lam: PCB hpe mai byin ai daram paving galaw ra ai. Double panel rai yang, maga lahkawng yan hpe shara kaba hta magri hte htu nna, ga npu na hka htung ni law law nga ra ai. Dai gaw mali-layer board (sh) dai hta jan ai rai yang, madung daw layer a makau na plane layer hpe formation langai hku nna tawn da ra ai.
5) grounding ra ai lam ni: static wan hpe hkrak hkra shapraw lu na matu, grounding kaja hpe hkam la ra ai. Ga shadawn, tsi mawan jak ni, monitor zawn re ai general tsi mawan jak ni, fuselage a hpang e maren mara n-gun rawng ai grounding end nga na re. ESD chyam dinglik ai lam galaw ai shaloi, ndai grounding end mung mungkan ga hte matut da ai majaw, n shamu n shamawt ai wan hpe lawan ladan shapraw kau lu na ladat nga ai. 6) PCB layout wiring: Chip a decoupling capacitor gaw chip a pin hte tsan ai rai yang, decoupling effect hpe sum mat na re. Sensitive signal ni a line grai galu yang, n myit mada ai sha wan n-gun n-gun shayawm ai lam byin wa na re. Anti-ESD hte seng nna, nbung pru ai lam gaw jak ni hte signal line ni hpe hkrak n hkra hkra, sensitive device (sh) signal line (reset zawn re ai) ni hpe PCB a jut kaw na tsan gang tawn da ra ai. PCB a jut kaw gap (sh) copper a galu kaba ai lam langai ngai nga ra ai.
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